Basic Parameters |
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Main chip | RK3568 | CPU | ARM® Quad-core 64-bit processor, Quad-core Cortex-A55 | GPU | ARM G52 2EE Support OpenGL ES 1.1/2.0/3.2,OpenCL 2.0,Vulkan 1.1 | Video Processor | Support 4K VP9 and 4K 10bits H265/H264 video decoding, up to 60fps 1080P multi-format video decoding (WMV, MPEG-1/2/4, VP8) 1080P video encoding, support H.264, VP8 format Video post processor: de-interlacing, denoising, edge/detail/color optimization | Power Management | RK808 PMU Power Management Unit | RAM | 8GB dual channel 64Bit LPDDR4(1GB/2GB/4GB/8GB optional) | Storage | Up to 128GB high-speed eMMC (16GB/32GB/64GB/128GB optional) | Hardware Features | Ethernet | Integrated GMAC Ethernet Controller*2 10/100/1000-Mbps data transfer rate supported using RGMII interface 10/100-Mbps data transfer rate Supported using RMII interface Support to expand Realtek RTL8211E to achieve 10/100/1000Mbps Ethernet | Wireless network | SDIO interface for expanding WiFi&Bluetooth 2-in-1 module Support 2.4GHz / 5GHz dual-band WiFi, 802.11a/b/g/n/ac protocol | Display | Video output interface: 1 x HDMI 2.0, support4K@60HZoutput and HDCP 1.4/2.2 Display interface (support dual-screen simultaneous display, dual-screen different display): 1 x MIPI-DSI, support dual channel2560x1600@60fpsoutput | Audio | 1 x HDMI 2.0 and 1 x DP 1.2 (DisplayPort), Audio Out 1 x SPDIF digital audio interface for audio output | Camera | 1 x MIPI-CSI camera interface (built-in dual hardware ISP, up to single 13Mpixel or dual 8Mpixel)(developer mode) | PCIE | 1 x PCIe2.1 interface | Power | 12V (voltage error ±5%) | USB | USB3.0 × 2 | Debug | Debug serial port × 1 for development and debugging | Interface | 3 × SDMMC, 3 × SPI, 10 × UART, 6 × I2C x 6, 2 × I2S/PCM(2ch)/TDM(8ch),16×PWM ,7 × ADC, 3 × CAN, 130 × GPIO | Power Dissipation | Standby power dissipation:0.015W Typical power dissipation: 2.9W Maximum power dissipation: 5.6W | Environment | Working temperature: -10℃- 50℃ Storage temperature: -40℃- 85℃ Storage humidity: 10%~80% | System software | Core Board Size | 82mm × 50.5mm (plate thickness 1.2mm) | Interface Type | MXM3.0 (314 PIN, 0.5mm pitch) | PCB Specification | 8-layer board design, immersion gold process | Hardware Encryption | Hardware Support for Symmetric Algorithms SHA-256 & HMAC Hash including off-chip context save/restore AES-128: Encrypt/Decrypt, Galois Field Multiply for GCM |
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